? semiconductor components industries, llc, 2011 may, 2011 ? rev. 5 1 publication order number: mc74vhc50/d mc74vhc50 hex buffer the mc74vhc50 is an advanced high speed cmos buffer fabricated with silicon gate cmos technology. the internal circuit is composed of three stages, including a buf fered output which provides high noise immunity and stable output. the inputs tolerate voltages up to 7 v, allowing the interface of 5 v systems to 3 v systems. ? high speed: t pd = 3.8 ns (typ) at v cc = 5 v ? low power dissipation: i cc = 2 a (max) at t a = 25 c ? high noise immunity: v nih = v nil = 28% v cc ? power down protection provided on inputs ? balanced propagation delays ? designed for 2 v to 5.5 v operating range ? low noise: v olp = 0.8 v (max) ? these devices are pb ? free and are rohs compliant figure 1. logic diagram y1 a1 a2 a3 a4 a5 a6 y2 y3 y4 y5 y6 1 3 5 9 11 13 2 4 6 8 10 12 y = a a1 y1 1 a2 y2 1 a3 y3 1 a4 y4 1 a5 y5 1 a6 y6 1 figure 2. logic symbol 14 ? lead soic d suffix case 751a http://onsemi.com 14 ? lead tssop dt suffix case 948g pin connection and marking diagram (top view) device package shipping ordering information mc74vhc50dg soic 55 units/rail 13 14 12 11 10 9 8 2 1 34567 v cc a6 y6 a5 y5 a4 y4 a1 y1 a2 y2 a3 y3 gnd 14 ? lead soic eiaj m suffix case 965 mc74vhc50mg soic eiaj 50 units/rail function table l h a input y output l h for detailed package marking information, see the marking diagram section on page 4 of this data sheet. http://onsemi.com MC74VHC50DR2G soic 2500 units/t&r mc74vhc50dtr2g tssop 2500 units/t&r
mc74vhc50 http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage 0.5 to 7.0 v v in dc input voltage 0.5 to 7.0 v v out dc output voltage 0.5 to v cc 0.5 v i ik dc input diode current v i < gnd 20 ma i ok dc output diode current v o < gnd 20 ma i out dc output sink current 25 ma i cc dc supply current per supply pin 50 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance (note 1) soic tssop 125 170 c/w msl moisture sensitivity level 1 f r flammability rating oxygen index: 30 to 35 ul 94 v ? 0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) > 2000 > 200 2000 v i latch ? up latch ? up performance above v cc and below gnd at 85 c (note 5) 300 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm ? by ? 1 inch, 2 ? ounce copper trace with no air flow. 2. tested to eia/jesd22 ? a114 ? a. 3. tested to eia/jesd22 ? a115 ? a. 4. tested to jesd22 ? c101 ? a. 5. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc supply voltage 2.0 5.5 v v i input voltage (note 6) 0 5.5 v v o output voltage (high or low state) 0 v cc v t a operating free ? air temperature 55 125 c t/ v input transition rise or fall rate v cc = 3.0 v 0.3 v v cc = 5.0 v 0.5 v 0 0 100 20 ns/v 6. unused inputs may not be left open. all inputs must be tied to a high ? or low ? logic input voltage level. note: the ja of the package is equal to 1/derating. higher junction temperatures may affect the expected lifetime of the device per the tab le and figure below.
mc74vhc50 http://onsemi.com 3 dc electrical characteristics v cc t a = 25 c t a 85 c t a 125 c symbol parameter test conditions (v) min typ max min max min max unit v ih minimum high ? level input voltage 2.0 3.0 4.5 5.5 1.5 2.0 3.15 3.85 1.5 2.0 3.15 3.85 1.5 2.0 3.15 3.85 v v il maximum low ? level input voltage 2.0 3.0 4.5 5.5 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 v v oh minimum high ? level output voltage v in = v ih or v il v in = v ih or v il i oh = ? 50 a 2.0 3.0 4.5 1.9 2.9 4.4 2.0 3.0 4.5 1.9 2.9 4.4 1.9 2.9 4.4 v v in = v ih or v il i oh = ? 4 ma i oh = ? 8 ma 3.0 4.5 2.58 3.94 2.48 3.80 2.34 3.66 v v ol maximum low ? level output voltage v in = v ih or v il v in = v ih or v il i ol = 50 a 2.0 3.0 4.5 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 4 ma i ol = 8 ma 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 v i in maximum input leakage current v in = 5.5 v or gnd 0 to 5.5 0.1 1.0 1.0 a i cc maximum quiescent supply current v in = v cc or gnd 5.5 2.0 20 40 a ????????????????????????????????? ????????????????????????????????? ac electrical characteristics (c load = 50 pf, input t r = t f = 3.0 ns) ???? ???? ???? symbol ??????? ??????? ??????? ????????? ????????? ????????? ??????? ??????? c ????? ????? 85 c ????? ????? 125 c ?? ?? ?? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ???? ???? ???? t plh , t phl ??????? ??????? ??????? ??????? ??????? ????????? ????????? ????????? 0.3 v c l = 15 pf c l = 50 pf ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ???? ???? ???? ????????? ????????? ????????? 0.5 v c l = 15 pf c l = 50 pf ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? ?? ???? ???? ??????? ??????? ????????? ????????? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ??? ?? ?? typical @ 25 c, v cc = 5.0 v pf 18 7. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no ? load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc . noise characteristics (input t r = t f = 3.0 ns, c l = 50 pf, v cc = 5.0 v) symbol characteristic t a = 25 c unit typ max v olp quiet output maximum dynamic v ol 0.8 1.0 v v olv quiet output minimum dynamic v ol ? 0.8 ? 1.0 v v ihd minimum high level dynamic input voltage 3.5 v v ild maximum low level dynamic input voltage 1.5 v
mc74vhc50 http://onsemi.com 4 figure 3. switching waveforms v cc gnd 50% 50% v cc a y t phl t plh *includes all probe and jig capacitance figure 4. test circuit c l * test point device under test output figure 5. input equivalent circuit input marking diagrams (top view) 14 ? lead soic d suffix case 751a 14 ? lead tssop dt suffix case 948g 13 14 12 11 10 9 8 2 1 34567 13 14 12 11 10 9 8 2 1 34567 14 ? lead soic eiaj m suffix case 965 13 14 12 11 10 9 8 2 1 34567 vhc50 vhc awlyww* 50 alyw* *see applications note #and8004/d for date code and traceability information. vhc50 alyw*
mc74vhc50 http://onsemi.com 5 package dimensions soic ? 14 case 751a ? 03 issue j notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. ? a ? ? b ? g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t ? t ? f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 7.04 14x 0.58 14x 1.52 1.27 dimensions: millimeters 1 pitch soldering footprint 7x
mc74vhc50 http://onsemi.com 6 package dimensions tssop ? 14 case 948g ? 01 issue b dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ? w ? . s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ? u ? seating plane 0.10 (0.004) ? t ? ??? ??? ??? section n ? n detail e j j1 k k1 ? w ? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ? v ? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint
mc74vhc50 http://onsemi.com 7 package dimensions soeiaj ? 14 case 965 ? 01 issue b h e a 1 dim min max min max inches --- 2.05 --- 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.004 0.008 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 --- 1.42 --- 0.056 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). 0.13 (0.005) m 0.10 (0.004) d z e 1 14 8 7 e a b view p c l detail p m a b c d e e l m z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 mc74vhc50/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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